A-B 1746-P6 SLC 500 modular power supplies

Processor Communication Options

The SLC 500 processors support several communication options. 

The following sections describe the available physical connections and protocol options used by the SLC 500 processors.

Physical Connection Options

Ethernet (10/100Base-T) channel offers:

• 10/100 Mbps communication rate.

• ISO/IEC 8802-3STD 802.3 (RJ45) connector for 10/100Base-T media.

• TCP/IP communication protocol.

• built-in isolation.

Data Highway Plus (DH+) channel offers:

• communication rates of 57.6 Kbaud, 115.2 Kbaud, and 230.4 Kbaud.

• maximum network length of 3048 m (10,000 ft) at 57.6 Kbaud

• Belden 9463 (blue hose) cable connection between nodes (daisy chain connection).

• built-in isolation.

DH-485 channel offers:

• configurable isolation via the 1747-AIC or 1761-NET-AIC interfaces.

• maximum network length of 1219 m (4000 ft).

• RS-485 electrical specifications.

• Belden 9842 or Belden 3106A cable connection between nodes (daisy-chain connection).

RS-232 channel offers:

• communication rates up to 19.2 Kbaud (38.4 Kbaud SLC 5/04 and SLC 5/05 processors).

• maximum distance between devices is 15.24 m (50 ft).

• RS-232C (EIA-232) electrical specifications.

• modem support.

• built-in isolation.

Selecting Modular Processors 

SLC 500 modular processors are designed to meet a wide range of applications, 

from small stand-alone to large distributed systems and from simple to complex applications. 

Processor Features Memory size - The SLC 500 modular processors memory is user configurable for either data storage or program storage. 

Memory size is 1 K...64 K. I/O points - The SLC 5/01 processor supports addressing of up to 3940 I/O. 

The SLC 5/02, SLC 5/03, SLC 5/04, and SLC 5/05 processors support addressing of 4096 I/O. 

The SLC 500 modular processors are supported by over 60 different I/O modules including digital, analog, and intelligent I/O. 

Performance - The SLC 500 modular processors are designed with throughput performance in mind. 

The program scan time for a typical instruction mix are 0.9 ms/K...8.0 ms/K depending on the processor. 

I/O scan times are 0.25 ms...2.6 ms depending on the processor and I/O installed in the system. 

Advanced instruction support - The instructions available depends on the processor used. 

The following table lists the instructions supported by the SLC 500 modular processors.

Barrel Control

Select barrel control for multiple–zone applications in which there is

thermal conduction between the zones. Injection molding and

extrusion are good example applications because they use multiple

heater bands (zones) mounted on one thermal conductor (the metal

barrel). The barrel conducts heat between different zones. If you

select barrel control, also select between inner and outer zones (word

1, bit 13 for channel 1). A barrel loop is autotuned as the temperature

rises from a cold start to a temperature setpoint during startup.