A-B 1746-OV32 module Rockwell SLC 32-point digital output control

Barrel Control

Select barrel control for multiple–zone applications in which there is

thermal conduction between the zones. Injection molding and

extrusion are good example applications because they use multiple

heater bands (zones) mounted on one thermal conductor (the metal

barrel). The barrel conducts heat between different zones. If you

select barrel control, also select between inner and outer zones (word

1, bit 13 for channel 1). A barrel loop is autotuned as the temperature

rises from a cold start to a temperature setpoint during startup.

Non–barrel control

Select non–barrel control for applications with independent loops and

no thermal conduction between zones. If you select non–barrel

control, the inner/outer zone selection doesn’t apply.

Switching the barrel control

For some applications, even though the loops are independent with

no thermal conduction between zones, barrel control might provide

better performance than non–barrel control. If a loop has any of these

characteristics, you might want to use barrel control if the:

• time constant is greater than 10 - 30 seconds

• loop has a problem of overshooting the setpoint

• loop output is saturating (CV is at 100%) for a significant duration

Output response

When the slot for this module is disabled, configuration words in the

SLC processor’s output image table are held in their last state and not

transferred to the module. When the slot is re–enabled, output image

table words are transferred to the module during the subsequent scan.

Installing and Wiring

This document gives you information about:

• avoiding electrostatic damage

• compliance with European Union directive

• determining the module’s chassis power requirement

• planning for sufficient enclosure depth

• choosing a module slot in a local I/O chassis

• installing the module

• wiring the module

Installing the Module

Follow this procedure:

ATTENTION

!

Never install, remove, or wire modules with power applied to the chassis or devices wired to the module.

1. Align the circuit board of the thermocouple module with the card guides located at the top and bottom of the chassis.

2. Slide the module into the chassis until both top and bottom retaining clips are secured. 

Apply firm even pressure on the module to attach it to its backplane connector.

Never force the module into the slot.

3. Cover unused slots with the card slot filler, catalog number 1746–N2.

4. To remove, press the releases at the top and bottom of the module, and slide the module out of the chassis slot.

Module Addressing

When you enter the module ID in processor configuration (off-line),

the processor automatically reserves the required number of I/O

image table words. In the figure below, that section of the I/O image

table is designated by “slot e”. Its location in the I/O image table is

determined by the module’s slot location “e” in the I/O chassis. Slot

location “e” is a required addressing unit when referring to the

module in ladder logic. For the sample program’s data table layout

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A-B 1756-OB8EI module Rockwell ControlLogix 8 digital output

A-B 1756-OB8I module Rockwell ControlLogix 8 digital output

A-B 1756-OC8 module Rockwell ControlLogix 8 digital output

A-B 1756-OF4 module Rockwell ControlLogix 4 analog

A-B 1756-OF6CI module Rockwell ControlLogix 6 analog

A-B 1756-OF6VI module Rockwell ControlLogix 6 analog

A-B 1756-OF8 module Rockwell ControlLogix 8 analog

A-B 1756-OF8H module Rockwell ControlLogix 8 analog

A-B 1756-OG16 module Rockwell ControlLogix 16 digital output

A-B 1756-OH8I module Rockwell ControlLogix 8 digital output

A-B 1756-ON8 module Rockwell ControlLogix 8 digital output

A-B 1756-OV16E module Rockwell ControlLogix 16 digital output

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A-B 1756-PB75 Module Rockwell ControlLogix DC Power Supply

A-B 1756-PB75R Module Rockwell ControlLogix DC Power Supply

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A-B 1756-PC75 Module Rockwell ControlLogix DC Power Supply

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