The MU360 complies with the main standards for digital
substation IEC 61869-9. IEC 61850 edition 2.1 and IEC 61869
13. which guarantees its interoperability and compliance to the
requirements for being the physical to digital interface of modern
digital substations. Furthermore, measurements of each CT/VT
set may be broadcasted in protection and power quality profiles,
allowing multiple Protection, Automation and Control applications
to consume the data without needing extra footprint for acquisition.

Test Modes
IEC 61850 edition 2.1 provides standard mechanisms for testing
purposes, reducing commissioning complexity and allowing new bay
installations without affecting substation operation.
With the test modes in MU360 users can independently configure
mode and behavior of each logical devices allowing then to operate
as: On, Test, Blocked, Test/Blocked and Off.
A Safer and Cybersecure Substation
Transmitting the instrument transformers´ measurements digitally
through optical fibers eliminates the risk of inadvertent mishandling
of the current and voltage circuits and makes the relay room a safer
work environment, eliminating hazards and reducing the risk of
personnel injury.
To ensure MU360 have all this connectivity in a cybersecure way, it
has been designed according to IEC 62443 and have all capabilities
described by SL2 of this standard, including RBAC, secure boot and
signed firmware.
The MU360 unlocks the full value of a completely digital substation, capable to be a single
I/O interface for Protection, Automation and Control applications to bay IEDs. Limiting the
field wiring just up to the MU360 reduces project complexity by reducing cabling, terminals,
and physical connections, which combined with a complete set of logical nodes allows
design standardization on the yard. Bay level IEDs can use data from redundant MU360
units, increasing system availability. Bay level IEDs can also be quickly replaced or added
using IEC 61850 test modes as no field wiring is involved. The MU360 has the additional
benefit of improving CT performance and cost through a lower connected burden and a
reduction in the number of CT cores required for an application.
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