A-B 1769-L24ER-QB1B CompactLogix 5370 L2 Controller

Each 1769 I/O module has a distance rating. 

In 1769 systems, the distance rating is the number of modules between the specific module and the 1769 power supply. 

In a 1768 system, the distance rating is the number of modules between the specific I/O module and the 1768 controller.

I/O Module Overview Each

I/O module includes a built-in removable terminal block with fingersafe cover for connections to I/O sensors and actuators.

The terminal block is behind a door at the front of the module. I/O wiring can be routed from beneath the module to the I/O terminals.

• Once the modules are locked together, the system becomes a rugged assembly.

• Upper and lower tongue-and-groove slots guide the module during installation and secure the module within the system.

• Removable terminal blocks help ease the wiring task.

• Self-lifting, field-wire pressure plates cut installation time.

• The patented bus connector with the lock function enables consistent and system communication.

• A color bar is provided on the front of the module.

• Digital and field circuits are optically isolated.

The 1769 Compact I/O™ modules can be used in the following applications:

• With a CompactLogix™ controller

• For expansion I/O in a MicroLogix™ 1500 controller assembly 

• In an assembly with a 1769-ADN DeviceNet adapter

• In an assembly with a 1769-AENTR Ethernet adapter.

Unless connected to a MicroLogix 1500 base, each bank of I/O modules must include its own power supply.

Install the I/O modules on a panel with two mounting screws or on a DIN rail.

The modules mechanically lock together with a tongue-and-groove design and have an integrated communication bus that is connected from module to module by a moveable bus connector.

Connect Ground Bus to Grounding-Electrode System

The grounding-electrode system is at earth-ground potential and is the central ground for all electrical equipment and ac power within any facility. 

Use a grounding-electrode conductor to connect the ground bus to the grounding-electrode system. 

Use at minimum 8.3 mm2 (8 AWG) copper wire for the grounding-electrode conductor to guard against EMI. 

The National Electrical Code specifies safety requirements for the grounding-electrode conductor.

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Hinweis zur Installation

Die Montageplatte (linke Endplatte) für das Netzteil verfügt über die in der 

nachfolgenden Abbildung dargestellten Schrauben. Die mittlere und die rechte 

Endplatte werden durch ein Gussform-Kupplungselement in Position gehalten, 

sodass keine Schrauben erforderlich sind.

Features and Benefits

Select I/O modules to exactly match your application. Combination

modules allow you to have inputs and outputs in a single slot for

efficient use of your chassis space.

Expand the I/O capacity of your fixed controller system. Two discrete

I/O modules can be added to the fixed controller’s 2-slot expansion

chassis increasing the flexibility of the system.

All relay contacts are Silver Cadmium with Gold overlay. Gold plating

resists oxidation and tarnishing resulting from non-use. Silver

Cadmium acts as an excellent conductor.

High-density 32-Point DC I/O and fast response DC inputs are available.

These modules allow you to apply the SLC 500 processors in a

broader spectrum of control applications.

Contacting Rockwell Automation

If you need to contact Rockwell Automation for assistance, please have the following information available when you call:

• A clear statement of the problem including a description of what the system is doing, LED indicator status, and bit status of I/O image words (channel configuration and status) for the module

• Fault code if the SLC processor is faulted

• Processor type and firmware (FRN) number from label on processor

• A list of things you have already tried to remedy the problem

• Hardware types in the system including I/O modules and chassis