Woodward 9927-2582 easYgen-3000XT Software Tools

The MicroNet Plus Expansion Chassis may use either single or redundant power supplies.

Each power supply module produces three regulated outputs: 

24 V @ 12 A (max), 5 V @ 32 A (max, derated above

55 degree C external ambient temperature), and 5 V Precharge @ 3 A (max).

A motherboard located on the back of the chassis provides the 

interconnection of the three outputs from each power supply module

into three corresponding power busses: 24 V bus, 5 V bus, and 5 V precharge bus.

The 24 V and 5 V busses are load shared between the two power supply modules.

In a TMR5200 based system, each Kernel CPU provides Real Time Network (RTN) capability for 

expanding to other racks using Ethernet port 4 (RJ45). This RTN port communicates between the main 

chassis CPU's and any Remote RTN modules located in an expansion chassis. The GAP software 

application defines the expansion racks, their I/O modules, and the use of the RTN port (GAP block is RTN).

Up to two Remote RTN modules may be installed into each MicroNet Plus 8/14 expansion chassis (only 

one RTN for 6/12 slot expansion chassis). When initialized by the main chassis CPU, the Remote RTN 

modules will acquire either a SYSCON or STANDBY status. The Remote RTN module that becomes 

SYSCON will control the expansion chassis where it is located. It will synchronize with the STANDBY 

Remote RTN module and perform any redundancy functions as necessary. Input and output data from all 

I/O modules will be managed appropriately and made available to the GAP Application running in the 

main-chassis CPUs.