Woodward 8444-1094 MFR300 kW Transducers with Protection

The MicroNet Plus Expansion Chassis may use either single or redundant power supplies.

Each power supply module produces three regulated outputs: 

24 V @ 12 A (max), 5 V @ 32 A (max, derated above

55 degree C external ambient temperature), and 5 V Precharge @ 3 A (max).

A motherboard located on the back of the chassis provides the 

interconnection of the three outputs from each power supply module

into three corresponding power busses: 24 V bus, 5 V bus, and 5 V precharge bus.

The 24 V and 5 V busses are load shared between the two power supply modules.

Module Operation

For redundant systems, up to two Remote RTN modules may be installed into each MicroNet Plus 8/14

slot expansion chassis (only one RTN can be installed in the MicroNet 6/12 slot chassis). When initialized

by the main chassis CPU, the Remote RTN modules will acquire either a SYSCON or STANDBY status.

The Remote RTN module that becomes SYSCON will control the expansion chassis it is located in. It will

synchronize with the STANDBY Remote RTN module and perform any redundancy functions as

necessary. Input and output data from all I/O modules will be managed appropriately and made available

to the GAP Application running in the main-chassis CPUs.

The Remote RTN module communicates with the I/O modules in the expansion chassis and also the CPU

modules in the main chassis. When the power is applied, the Remote RTN module will perform diagnostic

tests before beginning communications.