GE IS200CABPG1B Control Assembly Backplane Board

Part Number IS200CABPG1B Manufacturer General Electric Country of Manufacture As Per GE Manufacturing Policy Series Mark VI/VIe Function Module Availability In StockIS200CABPG1B is a Control Assembly Backplane Board manufactured by General Electric as a part of the Mark VI series used in the gas turbine control systems. The IS200CABP Control Assembly Backplane (CABP) board is a multilayer printed wiring board that enables connectivity for printed wiring boards inserted into it as well as external signal interfaces. The number of boards installed depends on the power level and application of the Innovation Series drive to which the CABP board belongs. 

These boards are: IS200BAIA Bridge Interface Board (BAIA) IS215GBIA Auxiliary Genius Interface Module (GBIA), IS215PBIA Auxiliary Genius Interface Module (GBIA) IS200ACL Application Control Layer Board (ACL) or Profibus Interface Module (PBIA) Digital Signal Process Control Board (DSPX) IS200DSPX (Optional) Rack Power Supply Board IS200RAPA (RAPA) Interface board for the Bridge (FOSA) IS200BPI Drive Bridge Personality Interface Board (BPI) or IS200FOSA External interfaces such as user control inputs/outputs (I/O), four front panel meters, diagnostic/configuration tools, a front panel keyboard, four ISBus ports, and power supply inputs are also accessible via connectors. 

The CABP board is mounted to the Innovation Series board rack, which has mounting points for each board. A single IS200HFPA High-Frequency AC/Fan Power Supply Board powers the CABP board (HFPA). For the 48 V AC power, a twisted/shielded pair cable is used, and a separate isolated twisted pair cable is used for the 17 V AC power. These cables have a 1000 V DC isolation. The CABP board connects the isolated power returns to the control cabinet common (CCOM) either indirectly or directly via an impedance (resistor/capacitor). It also links DCOM and CCOM. Provisions are made for all cable shields (where appropriate) to be connected directly to the chassis. Each for CCOM and Chassis Ground, there are two application-specific stab-on connectors (GND). The mounting screws connect GND to the board rack chassis. A capacitor is used to connect CCOM and GND. 

The stab-on connections link the CABP board CCOM to the control cabinet CCOM. HARDWARE FEATURES Near the application cable entry into the cabinet are the terminal boards associated with the CABP board for user I/O. Two multi-conductor cables connect to these terminal boards, one for low voltage (less than 50 volts) and the other for high voltage (more than 50 volts). Board connectors are either individually keyed, utilize different connectors (96 pins versus 128 pins) for identical modules, or keep the same pin assignments so that modules can be swapped out without causing damage.