Enabling high-precision CO2 laser drilling for advanced PCB processing:
SCANLAB’s intelliDRILLse II and the new excelliDRILL are specialized
scan systems designed for demanding microdrilling tasks such as high
density interconnects (HDI).
Modern printed circuit boards require an ever-increasing number of
vertical interconnects, also known as vias. The density of these
interconnects continues to increase, while their size decreases.
Precision is of central importance for the functional implementation of
such designs. At the same time, manufacturing methods must offer very
high throughput.

Technology Overview
Laser drilling is an ideal process for the application, as it allows a very large
number of fine holes to be produced with a very high degree of precision.
For CO2 drilling processes, the laser spot has to be moved to a designated
position and it has to be settled precisely within tolerance, whereafter the
laser is triggered. A key requirement for this is a suitable scan system that
is capable of performing this “jump and shoot” process with maximum
efficiency. intelliDRILLse II and excelliDRILL are developed to meet the
specific requirements of high-precision microdrilling tasks.
intelliDRILLse II
intelliDRILLse II is specifically designed for tasks, where fast positioning and
reliable beam control are essential – particularly for microdrilling.
The compact design allows for easy integration. Its lightweight beryllium
mirrors and digital encoder technology enable fast and accurate beam
positioning across varying jump distances. The system supports throughput
-oriented production environments. Optional SCANahead technology enables
predictive motion control of galvanometer axes and stage axes.

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