Edwards CTI-CRYOGENICS® ENHANCED ON-BOARD 8F CRYOPUMP

Today’s sputtering processes demand the highest possible process tool availability.

The new, enhanced On-Board 8F Cryopump improves tool availability – by cutting

regeneration frequency significantly.

It delivers better vacuum recovery in processes such as aluminum, TiN, titanium,

and other sputtering applications. So you can run more wafers between

regenerations. And with regenerations being less frequent, it’s easier for you to

schedule them at the same time as shield or target changes.

Your results – more tool availability, and more product wafer output.

Improved Vacuum Recovery Cuts Regeneration Frequency In Half

Many sputtering applications use a vacuum recovery step to maximize process

performance. In this step, the process chamber must be pumped to a specified high

vacuum level, within a specific time, after the feed gas is shut off. This step is a

principal driver of cryopump regeneration frequency.

The enhanced On-Board 8F Cryopump maintains fast recovery performance longer,

for fewer regenerations, in both argon- and nitrogen/argon-based sputtering.

The figures illustrate its recovery performance for both process types, using a target

recovery pressure of 1 x 10-7 Torr.

With recovery performance like this, you can cut your number of regenerations per

month by 40% to 65%. And fewer regenerations mean that it’s more likely you can

regenerate only during times when you’re doing a shield or target change.

(Note: Because pumping speeds for all gases are the same as in the On-Board 8F

and Cryo-Torr 8F, no process requalification is required.)

Features and Benefits

• Cuts Regeneration Frequency In Half

• Improves Sputtering Tool Availability

• Delivers Better Vacuum Recovery

• Increases Product Output BetweenRegenerations

• Backed by GUTS®(Guaranteed Uptime Support)