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CTI 2500-R16 Sixteen-Slot Base

From:CTI | author:Mr.Chen | Time :2025-11-21 | 310 view: | 🔊 Click to read aloud ❚❚ ▶ | Share:

Description

The 2500-R4 / 2500-R8 / 2500-R16 bases provide four, eight, or sixteen slots for I/O

modules in the SIMATIC® 505 or CTI 2500 Series platform.

The bases provide space for a power supply, a CPU or RBC, and slots for

up to four, eight, or sixteen I/O modules. The base may be mounted from the front or rear.

Features

• Replaces Siemens® 505-6504. 505-6508. or 505-6516

• Four, eight, or sixteen I/O slots

• Up to 128. 256. or 512 I/O points (4. 8. or 16 slot respectively)

• Mounts from the front or rear

Specifications

Mounting:

Front or rear mounting

Rack Size:

2500-R4: 8.02”W x 8.0”D x 10.47”H

204mm W x 203mm D x 266mm H

2500-R8: 11.22”W x 8.0”D x 10.47”H

285mm W x 203mm D x 266mm H

2500-R16: 17.62”W x 8.0”D x 10.47”H

448mm W x 203mm D x 266mm H

Operating Temperature:

0o to 60oC (32o to 140oF)

Storage Temperature:-40o to 85oC (-40o to 185oF)

Relative Humidity:

5% to 95% (non-condensing)

Agency Approvals Pending:

UL/ULC, Class1-Div.2-Haz.Loc., CE

Shipping Weight:

2500-R4: 5.0 lb.(2.27 Kg)

2500-R8: 8.0 lb.(3.63 Kg)

2500-R16: 14.0 lb.(6.35 Kg)

Power Supply, CPU/RBC, and I/O Location in Base

The power supply must always be installed in the left most slot of the

base. To the right of the power supply is a slot for a CPU or RBC. The

remaining 4. 8 (shown below) or 16 slots are for I/O or communication

modules.

CAUTION:

Use only CTI or Siemens® power supplies at their rated voltage. Damage to the

backplane board and other system components could occur if out of range

input voltage is applied.

Installing the Mounting Rack

Use the following steps for installing the mounting rack.

1.Determine if the rack will be mounted with front or rear mounts.

2.Locate the mounting ears in the appropriate front or rear locations with supplied

hardware.

3.Mount the rack with screws in four ‘ear’ slots (screw hardware not included).

Include sufficient distance from other heat sources to maximize convection

airflow cooling.

4.Follow manufacturer’s instructions for proper installation and removal of CPU,

RBC, and I/O modules.

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