Emerson PACSystems™ RXi2-BP Industrial PC Introduction

The Next Generation of Powerful, Reliable, Ruggedized Computing

Introduction

Emerson has developed the next generation of its powerful,

expandable, and reliable industrial computers (IPC).

PACSystems RXi2 IPCs offer new processor choices, increased

and faster storage, improved graphics, and enhanced

security features.

The PACSystems RXi2-BP IPC delivers compact, rugged,

mid to high range performance to run HMI, historian,

and analytics applications right at the machine, enabling

improved real-time control of operations and better

integration into plant-wide systems.

Combining outstanding compute capabilities with a compact

and robust enclosure, the PACSystems RXi2-BP is ideal for a

range of demanding industrial applications.

Greater Uptime

All aspects of the PACSystems RXi2-BP IPC have been

engineered for reliability in harsh environments. With high

quality industrial components, a rugged design, and fanless

operation, it is perfect for both commercial and industrial

applications. The PACSystems RXi2-BP IPC is a highly reliable

IPC with a long life cycle.

The foundation of the PACSystems RXi2-BP IPC architecture

is Emerson’s rugged COM Express modular CPU platform.

Emerson also incorporates patented thermal monitoring

technology with sophisticated passive cooling techniques

to provide the highest-performance, fanless industrial

computing platform that can operate in extended

temperature ranges.

Enhanced Productivity &

Lower Total Cost of Ownership (TCO)

The foundation of the PACSystems RXi2-BP IPC combines

high performance with reliability, enhancing productivity

and reducing cost of ownership. The PACSystems RXi2-BP

IPC delivers low TCO through features such as compact size,

reduced maintenance, low power consumption, and ease

of future performance upgrades enabled by our innovative

rugged COM Express CPU architecture.