The Next Generation of Powerful, Reliable, Ruggedized Computing
Introduction
Emerson has developed the next generation of its powerful,
expandable, and reliable industrial computers (IPC).
PACSystems RXi2 IPCs offer new processor choices, increased
and faster storage, improved graphics, and enhanced
security features.
The PACSystems RXi2-BP IPC delivers compact, rugged,
mid to high range performance to run HMI, historian,
and analytics applications right at the machine, enabling
improved real-time control of operations and better
integration into plant-wide systems.
Combining outstanding compute capabilities with a compact
and robust enclosure, the PACSystems RXi2-BP is ideal for a
range of demanding industrial applications.
Greater Uptime
All aspects of the PACSystems RXi2-BP IPC have been
engineered for reliability in harsh environments. With high
quality industrial components, a rugged design, and fanless
operation, it is perfect for both commercial and industrial
applications. The PACSystems RXi2-BP IPC is a highly reliable
IPC with a long life cycle.
The foundation of the PACSystems RXi2-BP IPC architecture
is Emerson’s rugged COM Express modular CPU platform.
Emerson also incorporates patented thermal monitoring
technology with sophisticated passive cooling techniques
to provide the highest-performance, fanless industrial
computing platform that can operate in extended
temperature ranges.
Enhanced Productivity &
Lower Total Cost of Ownership (TCO)
The foundation of the PACSystems RXi2-BP IPC combines
high performance with reliability, enhancing productivity
and reducing cost of ownership. The PACSystems RXi2-BP
IPC delivers low TCO through features such as compact size,
reduced maintenance, low power consumption, and ease
of future performance upgrades enabled by our innovative
rugged COM Express CPU architecture.
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