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MITSUBISHI ELECTRIC MELSEC iQ-R Series

From:MITSUBISHI ELECTRIC | author:Mr.Chen | Time :2026-03-31 | 427 view: | 🔊 Click to read aloud ❚❚ ▶ | Share:

iQ Platform-compatible PAC High-speed Digital I/O and  Analog I/O Modules

Maximize productivity with ultrahigh-speed

digital and analog modules

The MELSEC iQ-R Series lineup includes various

ultrahigh-speed digital I/O and analog I/O modules, making

them ideal for high-speed performance applications. Digital

input modules support response times from 1 μs and output

modules support response times of 2 μs. Analog input modules

support a fixed sampling cycle of 1 μs per channel and 5 μs

over all four channels.

Maintain manufacturing quality with

high-speed synchronization

Both digital and analog modules enable high-speed

synchronization across multiple modules. With analog

modules, machine performance can be improved by enabling

simultaneous sampling of five or more channels (simultaneous

conversion of four channels per module), realizing high

accuracy and faster control performance.

Reduce hardware costs by setting different

response times for each digital input point

A different response time can be set for each input point of the

high-speed input module. This functionality enables different

devices operating at different response speeds to be connected

to the same input module, helping to reduce the total cost as

less hardware is required.

Simple preventative maintenance utilizing

continuous logging

The analog module includes continuous logging that enables

the module to log contiguous data, such as from vibration

sensors on a motor. This data can then be analyzed, enabling

faults to be highlighted leading to the correct planning of

maintenance.

Improve performance of closed-loop control

The analog output module supports high-speed conversion of

1 μs improving output speed performance. This enables faster

response of a feedback control system, such as drive control

where speed is controlled by analog signals.

Highlights

Digital I/O modules

•Response times*1 from 1 μs (input) and 2 μs (output)

•8-point common terminal*2. mixing different sensor types

•Digital filter supporting 20 μs and 50 μs input response

times (different times can be set for each input point)

Analog I/O modules

•High-speed conversion (input:1 μs, output:1 μs) and 16-bit

high resolution

•Simultaneous multi-channel conversion (no. of channels

increased with inter-modular synchronization)

•Preventative maintenance with continuous logging function

• Improve performance of closed-loop control systems

❶ High-speed data measurement of tire profile

High-speed analog measurements between multiple sensors can be synchronized, leading to

improved accuracy of inspection data. Measurements are made at high speed, supporting

5 µs simultaneous sampling rates over five or more channels. This can be used for applications

such as monitoring tire profiles during qualitative final inspection using geometric measuring

techniques (laser sensors), and detecting tires with defects such as radial runout, axial runout,

bulges, and tire side deformation.

❷ Monitoring of motor vibration characteristics

The analog modules support continuous logging that enable collection of analog

data at high speed (1 μs per channel, 5 μs over four channels) irrespective of the

control CPU scan time, which otherwise may result in portions of uncollected data.

This is useful for collecting vibration sensor data that is used to monitor motor

performance for detecting any progressive vibrations that may indicate the possibility

of a fault developing.

Greater accuracy of collected data Due to the analog modules high-speed data sampling

and improved resolution, even small changes in sensor output data values can be

visible, especially as values change at high speed.

❸ High-speed response

between product detection and reject mechanism High-precision synchronization

between inputs and outputs are ideal for situations requiring high-speed

performance between each process, such as for product detection and

rejection mechanisms in packaging machines. By utilizing the inter-modular

synchronization function, sensor performance is not affected by variations

in CPU scan time, which can normally 

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