Honeywell ControlEdge HC900 IO Modules

I/O Modules

The following I/O modules are available to create a custom 

control solution.

• 16 Channel Universal IO Module Galavanically isolated

Input/Output to chassis (p.29)

• 8-point universal analog input modules: Galvanic

isolation point to chassis inputs may be mixed on a

module and may include multiple thermocouple types,

RTDs, ohms, voltage or mill voltage types – all easily

assigned using the Process Control Designer

configuration tool. High point-to-point galvanic isolation

simplifies installation and saves the expense of external

isolation hardware (p.8).

• 16-point high level analog input module: each point is

configurable for V or mA. Galvanically isolated point to

chassis. Galvanically isolated point to point (p.12). 250

ohm shunt resistors can be added per channel.

• 4-point galvanically isolated analog output module.

Galvanically isolated point to chassis supports from 0 to

20mA each (p.14).

• 8-point analog output, galvanically isolated in 2 groups

of 4 points. Galvanically isolated point to chassis.

Supports from 0 to 20mA each (p.15).

• 16-point analog output, galvanically isolated in 4 groups

of 4 points. Galvanically isolated point to chassis.

Supports from 0 to 20mA each (p.16).

• 16-point digital input modules: Contact closure type, DC

Voltage, AC Voltage and AC/DC voltage types (p.17).

Galvanically isolated in groups of 8 channel to chassis

• 32-point digital input module: DC voltage. Galvanically

isolated point to chassis. Galvanically isolated in 2

groups of 16 points (p.2117).

• 8-point AC or 16-point DC digital output modules

(sinking type). Galvanically isolated point to chassis.

Galvanically isolated in 2 groups of 8 points (p.20).

• 32-point digital output: DC voltage (sourcing type).

Galvanically isolated point to chassis. Galvanically

isolated in 2 groups of 16 points (p.25).

• 8-point relay output module: four form C type and four

form A type relays. Galvanically isolated point to

chassis. Galvanically isolated relay to relay (p.22).

• 4 channel Pulse/Frequency/Quadrature I/O module.

Galvanically isolated point to chassis (p.26).