Product Overview
The Trusted® TMR 24 Vdc Digital Output Module interfaces to 40 field
devices. Triplicated diagnostic tests are performed throughout the Module
including measurements for current, and voltage on each portion of the voted
output channel. Tests are also performed for stuck on and stuck off failures.
Fault tolerance is achieved through a Triple Modular Redundant (TMR)
architecture within the Module for each of the 40 output channels.
Automatic line monitoring of the field device is provided. This feature enables
the Module to detect both open and short circuit failures in field wiring and
load devices.
The Module provides onboard Sequence of Events (SOE) reporting with a
resolution of 1 ms. An output change of state triggers an SOE entry. Output
states are automatically determined by voltage and current measurements
onboard the Module.
This Module is not approved for direct connection to hazardous areas and
should be used in conjunction with Intrinsic Safety Barrier devices.
Features
• 40 Triple Modular Redundant (TMR) output points per Module.
• Comprehensive, automatic diagnostics and self-test.
• Automatic line monitoring per point to detect open circuit and short
circuit field wiring and load faults.
• 2500V impulse withstand opto/galvanic isolation barrier.
• Automatic overcurrent protection (per channel), no external fuses
required.
• Onboard Sequence of Events (SOE) reporting with 1 ms resolution.
• Module can be hot-replaced online using dedicated Companion
(adjacent) Slot or SmartSlot (one spare slot for many Modules)
configurations.
• Front Panel output status light-emitting diodes (LEDs) for each point
indicate output status and field wiring faults.
• Front Panel Module status LEDs indicate Module health and
operational mode (Active, Standby, Educated).
• TϋV Certified IEC 61508 SIL 3.
• Outputs are powered in isolated groups of eight. Each such group is a
Power Group (PG).
Description
The TMR 24 Vdc Digital Output Module is a member of the Trusted range of
input/output (I/O) Modules. All Trusted I/O Modules share common
functionality and form. At the most general level, all I/O Modules interface to
the Inter-Module Bus (IMB) which provides power and allows communication
with the TMR Processor. In addition, all Modules have a field interface that is
used to connect to Module-specific signals in the field. All Modules are Triple
Modular Redundant (TMR).

All High Integrity I/O Modules are made up of four sections: Host Interface
Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU),
and the Front Panel Unit (or FPU).
Field Termination Unit (FTU)
The Field Termination Unit (FTU) is the section of the I/O Module that
connects all three FIUs to a single field interface. The FTU provides the Group
Fail-Safe Switches and passive components necessary for signal conditioning,
overvoltage protection, and EMI/RFI filtering. When installed in a Trusted
Controller or Expander Chassis, the FTU field connector interconnects to the
Field I/O Cable Assembly attached at the rear of the Chassis.
The SmartSlot link is passed from the HIU to the field connections via the
FTU. These signals go directly to the field connector and maintain isolation
from the I/O signals on the FTU. The SmartSlot link is the intelligent
connection between Active and Standby Modules for coordination during
Module replacement.

Field Interface Unit (FIU)
The Field Interface Unit (FIU) is the section of the Module that contains the
specific circuits necessary to interface to the particular types of field I/O
signals. Each Module has three FIUs, one per slice. For the TMR 24 Vdc Digital
Output Module, the FIU contains one stage of the output switch structure,
and sigma-delta (ΣΔ) output circuit for each of the 40 field outputs. Two
additional ΣΔ circuits provide optional monitoring of the external field I/O
supply voltage.
The FIU receives isolated power from the HIU for logic. The FIU provides
additional power conditioning for the operational voltages required by the
FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to one of
the HIU slices.
The FIU also measures a range of onboard "housekeeping" signals that assist
in monitoring the performance and operating conditions of the Module.
These signals include power supply voltages, current consumption, onboard
reference voltages and board temperature.
Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the Module.
It also provides power distribution and local programmable processing
power. The HIU is the only section of the I/O Module to directly connect to the
IMB Backplane. The HIU is common to most high integrity I/O types and has
type dependent and product range common functions. Each HIU contains
three independent slices, commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to help
prevent any fault interaction between the slices. Each slice is considered a
Fault Containment Region (FCR), as a fault on one slice has no effect on the
operation of the other slices.
The HIU provides the following services common to the Modules in the
family:
• High-Speed Fault Tolerant Communications with the TMR Processor
via the IMB interface.
• FCR Interconnect Bus between slices to vote incoming IMB data and
distribute outgoing I/O Module data to the IMB.
• Galvanically isolated serial data interface to the FIU slices.
• Redundant power sharing of dual 24 Vdc chassis supply voltage and
power regulation for logic power to HIU circuitry.
• Magnetically isolated power to the FIU slices.
• Serial data interface to the FPU for Module status LEDs.
• SmartSlot link between Active and Standby Modules for coordination
during Module replacement.
• Digital Signal Processing to perform local data reduction and
self-diagnostics.
• Local memory resources for storing Module operation, configuration,
and field I/O data.
• Onboard housekeeping, which monitors reference voltages, current
consumption and board temperature.
Front Panel Unit (FPU)
The Front Panel Unit (FPU) contains the necessary connectors, switches,
logic, and LED indicators for the Front Panel. For every type of Trusted I/O
Module, the FPU contains the Slice Healthy, Active/Standby, the Educated
LED indicators, and the Module removal switches. Additional bicolor LEDs
provide status indication for the individual I/O signals. Serial data interfaces
connect the FPU to each of the HIU slices to control the LED status indicators
and monitor the Module removal switches.
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